Xintec Inc. (TPEX: 3374)
Information Technology · Semiconductors & Semiconductor Equipment · TW
NT$306.50
-5.69% today · +124.5% 1Y
Xintec Inc. (TPEX: 3374) operates in the Semiconductors & Semiconductor Equipment industry within the Information Technology sector. The company is valued at $2.61B and employs 1,498 people.
Over the last twelve months the share price has gained 124.5%, trading between 127.00 and 418.50.
Tweenvest scores Xintec Inc. across four factors: quality 79/100, value 0/100, growth 20/100, dividend 38/100. Its strongest factor is quality.
3374 price history
Not enough price history to draw a chart yet.
Key figures
- Market cap
- $2.61B
- Revenue (TTM)
- $259.46M
- P/E
- 48.46
- EPS
- 6.32
- Dividend yield
- 0.82%
- Beta (5Y)
- 1.38
- 52-week high
- NT$418.50
- 52-week low
- NT$127.00
- Avg volume (3M)
- —
- Shares outstanding
- 271.36M
- Employees
- 1,498
- Next earnings
- —
About Xintec Inc.
Xintec Inc., founded in 1998 and based in Taoyuan City, Taiwan, is a leading specialist in sophisticated wafer-level chip scale packaging (WLCSP) solutions. The company maintains a global presence, serving markets across Asia, the United States, and Europe. Its extensive range of services includes WLCSP for crucial components such as image and environmental sensors. Xintec also provides wafer-level post-passivation interconnection (WLPI) specifically designed for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF devices. Additionally, they offer comprehensive wafer testing services. For optical sensors, Xintec delivers advanced chip scale packaging, incorporating features like side-wall interconnects and through-silicon via (TSV) redistribution layer products. These solutions accommodate diverse glass thicknesses and filters, and include glass bonding to wafers, available with or without a cavity. The company is also proficient in various wafer reconstruction methods, including front-side, backside, and stack wafer reconstruction, catering to mobile, automotive, and consumer electronics applications. They further specialize in wafer reconstruction with a glass lid, particularly for the automotive sector. Moreover, Xintec offers highly specialized packaging services for micro-electromechanical systems (MEMS) sensors. This encompasses wafer thinning, precise partial dicing of bonded wafers to expose bonding pads, and CSP utilizing via-last TSV for connecting pads from the wafer surface to the backside. They also employ dry etching of silicon to form large cavities, enhancing product performance. Supplementary offerings include 3D I/O redistribution, power and ground enhancement, and dual-side connection capabilities. Xintec's cutting-edge technologies are integral to a wide array of electronic products, such as tablets, notebooks, computers, and medical equipment.
- ISIN
- TW0003374005
- Founded
- 1987
- Listed since
- Dec 31, 2007
- Exchange
- Taipei Exchange
- Currency
- TWD
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Figures last refreshed Aug 18, 2026.