Micro-Mechanics (Holdings) Ltd. (SGX: 5DD)
Information Technology · Semiconductors & Semiconductor Equipment · SG
S$2.81
+1.81% today · +51.9% 1Y
Micro-Mechanics (Holdings) Ltd. (SGX: 5DD) operates in the Semiconductors & Semiconductor Equipment industry within the Information Technology sector. The company is valued at $307.08M and employs 450 people.
Over the last twelve months the share price has gained 51.9%, trading between 1.57 and 3.89.
Tweenvest scores Micro-Mechanics (Holdings) Ltd. across four factors: quality 89/100, value 14/100, growth 53/100, dividend 89/100. Its strongest factor is quality.
5DD price history
Not enough price history to draw a chart yet.
Key figures
- Market cap
- $307.08M
- Revenue (TTM)
- $54.81M
- P/E
- 28.28
- EPS
- 0.10
- Dividend yield
- 2.14%
- Beta (5Y)
- 0.28
- 52-week high
- S$3.89
- 52-week low
- S$1.57
- Avg volume (3M)
- —
- Shares outstanding
- 138.78M
- Employees
- 450
- Next earnings
- —
About Micro-Mechanics (Holdings) Ltd.
Established in Singapore in 1983, Micro-Mechanics (Holdings) Ltd. is a specialist in the engineering, manufacturing, and global distribution of high-precision parts and tools. These crucial components are essential for the wafer fabrication and assembly stages within the semiconductor industry. The company's operations span five distinct geographical segments: Singapore, Malaysia, the Philippines, the USA, and China. Micro-Mechanics offers a comprehensive array of products designed for various semiconductor production processes. Its solutions for die attach applications encompass pick-up tools, such as rubber tips, high-temperature plastic, and tungsten carbide instruments, along with sensor and vacuum wand assemblies. For dispensing operations, it provides products like nozzle adaptors, specialized nozzles, pen dispense systems, and epoxy stamping tools. The company also supplies critical die ejection essentials, including ejector needles, holders, and seals. Furthermore, Micro-Mechanics delivers thermosonic bonding products, such as clamps and electronic flame-off units, alongside ultrasonic bonding equipment that includes clamps, bearing base assemblies, anvils, and wire cutters. Its encapsulation product line features BGA dispensing nozzles, manifolds, pump screws, and O-rings. In addition to its standard offerings, the company undertakes contract manufacturing, fabricating custom precision parts and assemblies for original equipment manufacturers (OEMs).
- ISIN
- SG1O09910991
- Founded
- 1983
- Listed since
- Jun 25, 2003
- Exchange
- Singapore Exchange
- Currency
- SGD
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Figures last refreshed Aug 18, 2026.