China Wafer Level CSP Co., Ltd. (SHSE: 603005)
Information Technology · Semiconductors & Semiconductor Equipment · CN
CN¥26.99
-8.54% today · -19.2% 1Y
China Wafer Level CSP Co., Ltd. (SHSE: 603005) operates in the Semiconductors & Semiconductor Equipment industry within the Information Technology sector. The company is valued at $2.62B and employs 1,088 people.
Over the last twelve months the share price has lost 19.2%, trading between 25.92 and 55.26.
Tweenvest scores China Wafer Level CSP Co., Ltd. across four factors: quality 74/100, value 48/100, growth 82/100, dividend 8/100. Its strongest factor is growth.
603005 price history
Not enough price history to draw a chart yet.
Key figures
- Market cap
- $2.62B
- Revenue (TTM)
- $218.34M
- P/E
- 52.03
- EPS
- 0.52
- Dividend yield
- 0.44%
- Beta (5Y)
- 0.84
- 52-week high
- CN¥55.26
- 52-week low
- CN¥25.92
- Avg volume (3M)
- —
- Shares outstanding
- 651.42M
- Employees
- 1,088
- Next earnings
- —
About China Wafer Level CSP Co., Ltd.
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services, as well as packaging and testing services. In addition, the company offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives, as well as FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. Further, it engages in research and development; patent management; field application promotion; investment management; and technology development activities. It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
- ISIN
- CNE100001SM0
- Founded
- 2005
- Listed since
- Feb 10, 2014
- Exchange
- Shanghai Stock Exchange
- Currency
- CNY
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Figures last refreshed Oct 4, 2026.