Tweenvest Stocks

Amkor Technology, Inc. (NasdaqGS: AMKR)

Information Technology · Semiconductors & Semiconductor Equipment · US

$43.73

+4.87% today · +36.0% 1Y

Amkor Technology, Inc. (NasdaqGS: AMKR) operates in the Semiconductors & Semiconductor Equipment industry within the Information Technology sector. The company is valued at $10.86B and employs 30,800 people.

Over the last twelve months the share price has gained 36.0%, trading between 29.50 and 96.68.

Tweenvest scores Amkor Technology, Inc. across four factors: quality 79/100, value 38/100, growth 42/100, dividend 75/100. Its strongest factor is quality.

AMKR price history

Not enough price history to draw a chart yet.

Key figures

Market cap
$10.86B
Revenue (TTM)
$7.46B
P/E
19.63
EPS
2.23
Dividend yield
0.80%
Beta (5Y)
2.22
52-week high
$96.68
52-week low
$29.50
Avg volume (3M)
—
Shares outstanding
248.45M
Employees
30,800
Next earnings
—

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

ISIN
US0316521006
Founded
1968
Listed since
May 1, 1998
Exchange
Nasdaq Global Select
Currency
USD
CompanyMarket capPriceDay
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Onto Innovation Inc.NYSE: ONTO$10.90B$199.96-9.99%
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Novatek Microelectronics Corp.TWSE: 3034$10.82BNT$577.00+8.66%
BIWIN Storage Technology Co., Ltd.SHSE: 688525$10.82BCN¥153.47-15.21%
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Nova Ltd.NasdaqGS: NVMI$10.53B$331.22+3.44%

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Figures last refreshed Oct 18, 2026.